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No. 200 Newsletter

Recap Tyan at ISC2021

Products:
Dear Friends,

ISC 2021 has reached its conclusion in early July. We showcased our latest AI and HPC products on its online exhibition and would like to recap them in this newsletter. If you missed ISC 2021 Digital, you can still visit the Tyan 2021 Online Exhibition for the latest product updates.

Transport HX TN83-B8251

Transport HX TN83-B8251
2U2S 3rd Gen AMD EPYC™ platform supports up to 4 double-width GPU cards and 2 additional PCIe Gen.4 x16 slots for massively parallel GPU computing.
 

Transport HX TS75-B8252

Transport HX TS75-B8252
2U2S 3rd Gen AMD EPYC™ platform supports up to 32 DIMM and 12 hot-swap, tool-less 3.5" drive bays for virtualization, HPC and VDI applications.
 

Transport HX TS75A-B8252

Transport HX TS75A-B8252
2U2S 3rd Gen AMD EPYC™ platform supports up to 32 DIMM and 26 hot-swap, tool-less 2.5" drive bays for virtualization, HPC and VDI applications.
 

Transport HX FT65T-B8030

Transport HX FT65T-B8030
4U1S tower-convertible 3rd Gen AMD EPYC™ platform supports up to 4 double-width GPU cards for deskside GPU computing workload.
 

Thunder SX TS65-B7120

Thunder SX TS65-B7120
2U2S 3rd Gen Intel® Xeon® Scalable platform supports up to 5 PCIe Gen.4 slots and 12 hot-swap, tool-less 3.5" drive bays for AI inference applications.
 

Thunder HX FT83A-B7129

Thunder HX FT83A-B7129
4U2S 3rd Gen Intel® Xeon® Scalable platform supports up to 10 double-width GPU cards for a variety of GPU-based scientific HPC and AI training applications.
 

Tempest HX S7120

Tempest HX S7120
Industry-standard 2S 3rd Gen Intel® Xeon® Scalable server motherboard with 16 DIMMs, dual onboard 10GbE, 5 PCIe Gen.4 and 2 NVMe M.2 slots in SSI EEB (12" x 13.1") form factor.
 

Tempest HX S5642

Tempest HX S5642
Industry-standard 1S 3rd Gen Intel® Xeon® Scalable server motherboard with 8 DIMMs, dual onboard 10GbE, 5 PCIe Gen.4 and 2 NVMe M.2 slots in SSI CEB (12" x 10.6") form factor.
 


Events

Tyan 2021 Online Exhibition


 

Reference

Product Review:


 
 

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