Resource Center - Press Release

TYAN Unveils its Robuste Immersion Cooling Solution that Delivering Significant PUE Enhancement at SC23

Tyan also Showcased its Full Array of the Latest 4th Generation Intel® Xeon® Scalable Processor Platforms Targeting HPC, AI and Cloud Computing Applications
Products: S5565  S5567  S5652  S7130  S7136 
FT65TB5652  TS75AB7132 
Denver, Colorado– Supercomputing 2023 – Nov 14, 2023 – TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel® Xeon® Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.



Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet

The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.
 
“TYAN is keen in adopting the latest technology and dedicated in providing cutting-edge technology as well as Eco-Friendly Product portfolio,” said Eric Kuo, General Manager of Tyan Computer and the Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. “The fine example is the immersion-cooling system demonstrated at SC23. We are glad that TYAN product lines fitting well and operating perfectly in the immersion cooling system. TYAN will keep commitments in
collaborating with industry leaders and delivering top-tier solutions tailored to meet the needs of our valued customers."
 

TYAN also Showcases its Full Array of 4th Gen. Intel Xeon Scalable Processors Supporting Platforms that Meeting the Critical Demands from HPC, Cloud and AI Applications at SC23.



Targeting HPC and AI applications, TYAN presents its The TYAN TD76-B5658, FT65T-B5652, TS75A-B7132 server barebones, as well as S5652 and S7130 server motherboards. These products fulfill the heaving workload requirements and high-performance demands. Aiming in cloud computing environments, TYAN also showcase it’s could platforms including GC68A-B7136 server barebone and S7136 server motherboards. For customers looking for embedded solutions, TYAN also displays it’s S5565 and S5567 embedded server mother boards that fitting in flexible and density requirements.
 
As a subsidiary of MiTAC Computing Technology Corporation, TYAN also showcases another cutting-edge product portfolio of Mitac Computing Technology, which was inquired from Intel Data Center Solutions Group (DSG) from this July. The Intel Server D50DNP Family(known as Denali Pass) are the 4 computing nodes server platforms within a 2U enclosure. The Intel Server M50FCP Family(known as Fox Creek Pass) are 2-socket server solutions in 1U or 2U enclosure. Combining the mature Intel technology and Intel high design quality, Mitac’s multiple product offerings meeting various needs from server industry.
 

SUBSCRIBE NOW to get the latest news.

Clicking "OK" confirms your acceptance of our Terms of Use, Privacy Policy, and Cookie Policy.
Compare (xx)