In today's fast-paced digital landscape, the demand for efficient and reliable data center solutions has never been greater. With the exponential growth of data processing and storage requirements, maintaining optimal server performance while managing heat dissipation has become a critical challenge for data center operators.
With increasingly hotter GPUs and CPUs, traditional air cooling methods are often insufficient to address the thermal demands of modern, high-density server configurations. By harnessing the power of liquid to dissipate heat more effectively than air, liquid cooling solutions offer a superior alternative for thermal management in data center environments.
MiTAC Liquid Cooling Solutions for Intel® Data Center Group (DSG) Servers
Maximum Heat Transfer
Integrated liquid cooling loops capture heat directly from components for maximum heat transfer and minimal thermal throttling
D2C Design
Direct-to-chip (D2C) liquid cooling design enables ultimate compute performance and density for CPUs/GPUs
Easy Scalability
Modular and scalable architecture allows for easy upgrades and expandability as needs grow
Energy Efficiency
Energy-efficient implementation combining liquid cooling and hot-swap components reduces operating costs and carbon footprint
Why Choose MiTAC Liquid Cooling Solution?
The Intel® Server D50DNP family (Denali Pass) provides performance optimization tailored for high-performance computing (HPC) and artificial intelligence (AI) applications. With different configurations available, it enables optimization of compute density, leading to enhanced energy efficiency across your entire data center infrastructure. Its Compute module and Intel® Data Center GPU Max Series Accelerator module are liquid-cooling support through an integrated liquid-cooling loop that captures heat from the various components inside the module for maximum heat transfer and minimized thermal throttling.
% Heat DissipationLeading Technology Achieving 95% Heat Dissipation
The D50DNP liquid-cooled servers utilize specially designed cold plates to efficiently cool M.2 SSDs, PCIe add-in cards, PCH, and board components in parallel. This innovative design ensures that approximately 95% of the generated heat is absorbed by the liquid-cooling system. The remaining 5% of the heat is effectively dissipated through two 40mm fans, such as those used for radiating heat from optical fiber on the PCIe add-in card LAN connector.
D50DNP 1U Half-Width Compute module
High-performance compute module includes two high-speed processors in a 1U, half-width form factor. Its liquid-cooled option helps maximize compute density while also enhancing cooling efficiency, ultimately improving overall data center energy efficiency. One compute module requires one liquid-cooling loop. Up to four compute modules can be installed in one 2U half-width liquid-cooled chassis.
Compute Module Liquid-Cooling Loop Flow:
D50DNP 1U Full-Width Intel® Data Center GPU Max Series Accelerator Module
Intel Data Center GPU Max Series accelerator module supports up to eight per 2U chassis liquid-cooled design for incredible performance density. One Intel Data Center GPU Max Series Accelerator module requires one liquid-cooling loop for server board and one liquid-cooling loop for graphics processing unit (GPU) section. Up to two Intel Data Center GPU Max Series Accelerator modules can be installed in one 2U full-width liquid-cooled chassis.
Intel Data Center GPU Max Series Accelerator Module Liquid-Cooling Loop Flow:
MiTAC Liquid Cooling Servers
Intel® Server D50DNP family (Denali Pass)
Intel's liquid cooled servers offer high-performance computing power with support for two 5th/4th Gen Intel® Xeon® Scalable processors or Intel® Xeon® CPU Max Series with Integrated High Bandwidth Memory (HBM) at up to 385W* TDP. They feature ample memory capacity with 16 DDR5 DIMM slots per server module, along with two M.2 NVMe/SATA storage and two PCIe 5.0 expansion slots. The direct-to-chip liquid cooling with cold plates and chassis manifolds enables efficient heat dissipation, minimizing thermal throttling for these high-compute configurations.
(Support for CPU with 385W TDP in liquid-cooled configuration is under validation.)
D50DNP1MHCPLC Compute Module
2U 4-Node Liquid cooled Server
D50DNP1MFALLC Acceleration Module (EOL)
2U 2-Node Liquid cooled Server
Intel Server Chassis FC2000 v2 Family
The liquid-cooled Intel D50DNP servers are designed around the Intel Server Chassis FC2000 v2 Family, which features integrated liquid cooling capabilities. Each server module has its own dedicated liquid cooling loop, with plumbing connections at the rear of the chassis. While primarily liquid cooled, the system also includes two 40mm fans to provide residual airflow. The chassis accommodates four 3000W liquid-cooled power supply units participating in the liquid cooling loop. A liquid distribution manifold within the chassis supplies the coolant to the server modules as well as the power supplies and power distribution board for comprehensive liquid cooling coverage.
Liquid cooling components
1U Liquid-Cooled Compute Module Components
1U Liquid-Cooled Intel® Data Center GPU Max Series Accelerator Module Components
Liquid-Cooled Chassis Manifold
3000W Power Supply, liquid-cooled Common Redundant Power Supply
Compute Module Liquid-Cooling Loop
