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D50TNP (D50TNP1MHCRLC)

D50TNP1MHCRLC
(Item pictured is only a representation.)      

D50TNP
D50TNP1MHCRLC

 

1U Half-Width Compute Module with Direct-to-Chip Liquid Cooling

  • Up to 270W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 2 x16 PCIe 4.0 low-profile (LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 4 nodes, Direct-to-chip liquid-cooled
  • 3 2100W CRPS PSUs (80+ Platinum)
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D50TNP1MHCRLC Specifications

EssentialsSupplemental InformationMemory & StorageProcessor GraphicsExpansion OptionsI/O SpecificationsPackage SpecificationsAdvanced TechnologiesSecurity & Reliability
Essentials

Product CollectionIntel® Server D50TNP Family
Code NameProducts formerly Tennessee Pass
Launch DateQ2'21
Marketing StatusLaunched
Limited 3-year WarrantyYes
Extended Warranty Available for Purchase (Select Countries)Yes
Additional Extended Warranty DetailsDual Processor Board Extended Warranty
Chassis Form FactorRack
Board Form Factor8.33" x 21.5"
Compatible Product Series3rd Generation Intel® Xeon® Scalable Processors
SocketSocket-P4
TDP270 W
Board ChipsetIntel® C621A Chipset
Target MarketHigh Performance Computing
Rack-Friendly BoardYes
Integrated BMC with IPMIIPMI 2.0 & Redfish
Included Items(1) Intel® Server Board DDR4 D50TNP1SBCR / (1) 1U half-width module tray – iPN K53210 / (2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER / (2) 1U riser bracket to support TNP1UCRRISER – iPN K25206 / (1) Memory DIMM Removal Tool TNPDMMLTHTL / (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 / (1) Liquid-Cooling Loop Kit TNPLCLPCM (includes 8 pcs of DIMM clips – iPC FXXWKLCDMCLP)

Supplemental Information

DescriptionA 1U high-density half-width compute module integrated with Intel® Server Board DDR4 D50TNP1SBCR for large memory capability and flexible configuration options for the Intel® Server Chassis FC2000 Family
Embedded Options AvailableNo

Memory & Storage

Memory Types3DS-RDIMM / DDR4 (RDIMM) / Load Reduced DDR4 (LRDIMM) / 3DS-LRDIMM
Max # of DIMMs16
Max Memory Size (dependent on memory type)2 TB
Max # of Memory Channels16
ECC Memory Supported ‡Yes
Max Memory Bandwidth204.8 GB/s

Processor Graphics

Integrated Graphics ‡Yes
Graphics OutputVGA

Expansion Options

PCI Express Revision4.0
Riser Slot 1: Total # of Lanes16
Riser Slot 2: Total # of Lanes16
Max # of PCI Express Lanes32

I/O Specifications

# of USB Ports3
USB Revision3.0
Total # of SATA Ports2
USB ConfigurationOne USB 3.0 port / Two USB 3.0 ports (dual-stack)
Max # of UPI Links3
RAID Configuration0/1
# of Serial Ports1
Integrated LAN1

Package Specifications

Max CPU Configuration2

Advanced Technologies

Advanced System Management KeyYes
Intel® Node ManagerYes
Intel® Advanced Management TechnologyYes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡Yes
TPM Version2.0

Security & Reliability

Intel® Trusted Execution Technology ‡Yes
Intel® AES New InstructionsYes

 
 
 
 
 

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