D50TNP (D50TNP2MHSVAC)

D50TNP2MHSVAC
(Item pictured is only a representation.)      

D50TNP
D50TNP2MHSVAC

 

2U Half-Width Management Module with High-flow Air Cooling

  • Up to 270W 2S 3rd Gen Intel® Xeon® Scalable processors
  • 8+8 DDR4 DIMMs @ 3200 MT/s
  • 3 x16 and 1 x8 PCIe 4.0 low-profile(LP) slots
  • 2 M.2 SATA/NVMe SSDs 80 or 110 mm and 2 U.2 NVMe
  • 1 10GBase-T LAN and 1 1000Base-T dedicated IPMI ports
  • 2U 2 nodes, High-flow air cooling
  • 3 1600W (80+ Titanium)/ 2100W (80+ Platinum) CRPS PSUs

D50TNP2MHSVAC Specifications

Essentials

Product CollectionIntel® Server D50TNP Family
Code NameProducts formerly Denali Pass
Launch DateQ2'21
Marketing StatusLaunched
Limited 3-year WarrantyYes
Extended Warranty Available for Purchase (Select Countries)Yes
Additional Extended Warranty DetailsDual Processor Board Extended Warranty
Chassis Form Factor2U Rack
Board Form Factor8.33" x 21.5"
Compatible Product Series3rd Generation Intel® Xeon® Scalable Processors
SocketSocket-P4
TDP270 W
Board ChipsetIntel® C621A Chipset
Target MarketHigh Performance Computing
Rack-Friendly BoardYes
Integrated BMC with IPMIIPMI 2.0 & Redfish
Included Items(1) Intel® Server Board D50TNP1SB / (1) 2U half-width module tray – iPN K53211 / (1) 2U management module air duct – iPN K61939 / (2) 2U PCIe Riser (Two x16 PCIe slots, M.2 Connector and U.2 Connector) TNP2URISER, with U.2 PCIe* NVMe* SSD adapter card included / (2) 2U PCIe Riser (Two x16 PCIe slots, M.2 Connector and U.2 Connector) TNP2URISER / (1) 2U Air-Cooled front Heat Sink TNP2UHSF / (1) 2U Air-Cooled Rear Heat Sink TNP2UHSB / (2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 / (2) M.2 heat sink assembly TNPM2HS / (2) 2.5" tool-less SSD drive carrier – iPN J36439

Supplemental Information

DescriptionA 2U high-density Management Module integrated with the Intel® Server Board D50TNP1SB and up to 16 DDR4 DIMMs + up to 8 Intel® Optane™ persistent memory 200 series modules.
Embedded Options AvailableNo

Memory & Storage

Memory Types3DS-RDIMM / DDR4 (RDIMM) / Load Reduced DDR4 (LRDIMM) / 3DS-LRDIMM / Intel® Optane™ persistent memory 200 series
Max # of DIMMs24
Max Memory Size (dependent on memory type)6 TB
Max # of Memory Channels16
ECC Memory Supported ‡Yes
Max Memory Bandwidth204.8 GB/s
Intel® Optane™ Persistent Memory SupportedYes

Processor Graphics

Integrated Graphics ‡Yes
Graphics OutputVGA

Expansion Options

PCI Express Revision4.0
Riser Slot 1: Total # of Lanes32
Riser Slot 2: Total # of Lanes24
Max # of PCI Express Lanes56
PCIe OCuLink Connectors (NVMe support)8

I/O Specifications

# of USB Ports3
USB Revision3.0
Total # of SATA Ports2
USB ConfigurationOne USB 3.0 port / Two USB 3.0 ports (dual-stack)
Max # of UPI Links3
RAID Configuration0/1
# of Serial Ports1
Integrated LAN1

Package Specifications

Max CPU Configuration2

Advanced Technologies

Advanced System Management KeyYes
Intel® Optane™ Memory Supported ‡Yes
Intel® Node ManagerYes
Intel® Advanced Management TechnologyYes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡Yes
TPM Version2.0

Security & Reliability

Intel® Trusted Execution Technology ‡Yes
Intel® AES New InstructionsYes

 
 
 
 
 

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