Why AMD is creating a new standard for technical computing
Products: GC79AB8252, TN83B8251,
AMD EPYC™ 7003 Series processors are the ideal foundation for HPC servers that need to tackle today’s demanding technical computing workloads. Here's why.
When it became apparent after 2010 that Moore's Law for semiconductor advancement was beginning to break down, AMD decided to rethink the traditional monolithic approach to semiconductor design and manufacturing.
This led to the creation of a multi-chip-module design, using 'chiplets', to update the system on a chip (SoCs) with multiple blocks that are less expensive to manufacture and provide higher yields. AMD's latest CPUs, for example, consist of eight compute dies built on a 7nm process node, and a large I/O die built on a 14nm process node.
The first x86 technology with true 3D die stacking, 3D V-Cache enables AMD to vertically stack multiple layers of cache on a processor, boosting the CPU memory without increasing the size of the die or shrinking the logic circuits. This approach represents an innovative step forward in CPU design and packaging.
The technology is designed to deliver the world's highest performance x86 server processors for technical computing workloads that require intense computing power. This can include tasks such as Computational Fluid Dynamics (CFD), Electronic Design Automation (EDA), and Finite Element Analysis (FEA). They are easily the most complex and demanding workloads in the data center and are essential across a wide range of industries and sectors, including chemical engineering, finance, energy and the life sciences.
Software partners, such as Altair, Ansys and Synopsys, have reported significant performance breakthroughs running on systems with AMD 3D V-Cache processors [1].
In terms of hardware, modern servers such as the Tyan Transport CX GC79A-B8252 can leverage the newest EPYC CPUs to deliver high performance and low latency. This, in turn, leads to superior responsiveness for a variety of IO-intensive computing tasks.
The Tyan Transport HX TN83-B8251 is also built to take advantage of AMD processor technology. It's a 2U dual socket AMD EPYC 7003 Series processor-based server platform designed specifically for Accelerated HPC and Deep Learning (DL) computing. Support for up to 4DW / 8SW GPU cards enables parallel processing at scale for businesses large and small.
With 768 MB of L3 cache, 3rd Gen AMD EPYC processors with 3D V-Cache technology can deliver up to a 66% performance improvement [2] across a variety of targeted technical computing workloads compared to standard 3rd Gen AMD EPYC processors. This enables faster time-to-results on targeted workloads and the ability to get products to market faster.
Built for the most demanding technical computing workloads, the Tyan Transport series is a line of world class barebones server systems based on AMD's latest technology, including 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology. For more information about our newest products, view the Tyan/AMD Product Catalog 2022.
When it became apparent after 2010 that Moore's Law for semiconductor advancement was beginning to break down, AMD decided to rethink the traditional monolithic approach to semiconductor design and manufacturing.
This led to the creation of a multi-chip-module design, using 'chiplets', to update the system on a chip (SoCs) with multiple blocks that are less expensive to manufacture and provide higher yields. AMD's latest CPUs, for example, consist of eight compute dies built on a 7nm process node, and a large I/O die built on a 14nm process node.
The unending pursuit of improved performance
Cache size increases have been at the forefront of performance improvement, particularly for technical computing workloads that rely heavily on large data sets. But 2D chip designs have physical limitations on the amount of cache that can be built on the CPU. AMD has addressed this issue in its 3rd Gen AMD EPYC™ processors with the addition of 3D V-Cache™ technology.The first x86 technology with true 3D die stacking, 3D V-Cache enables AMD to vertically stack multiple layers of cache on a processor, boosting the CPU memory without increasing the size of the die or shrinking the logic circuits. This approach represents an innovative step forward in CPU design and packaging.
The technology is designed to deliver the world's highest performance x86 server processors for technical computing workloads that require intense computing power. This can include tasks such as Computational Fluid Dynamics (CFD), Electronic Design Automation (EDA), and Finite Element Analysis (FEA). They are easily the most complex and demanding workloads in the data center and are essential across a wide range of industries and sectors, including chemical engineering, finance, energy and the life sciences.
Lower latency, higher bandwidth
AMD's true 3D die stacking enables interconnect density that is 200x greater than current 2D technologies and 15x greater than other 3D technologies using solder bumps. The expanded interconnect density results in lower latency, higher bandwidth and greater thermal efficiencies, delivering impressive performance gains for technical computing workloads.Software partners, such as Altair, Ansys and Synopsys, have reported significant performance breakthroughs running on systems with AMD 3D V-Cache processors [1].
In terms of hardware, modern servers such as the Tyan Transport CX GC79A-B8252 can leverage the newest EPYC CPUs to deliver high performance and low latency. This, in turn, leads to superior responsiveness for a variety of IO-intensive computing tasks.
The Tyan Transport HX TN83-B8251 is also built to take advantage of AMD processor technology. It's a 2U dual socket AMD EPYC 7003 Series processor-based server platform designed specifically for Accelerated HPC and Deep Learning (DL) computing. Support for up to 4DW / 8SW GPU cards enables parallel processing at scale for businesses large and small.
A 66% performance improvement
Big Data computing workloads can also benefit from AMD EPYC-powered systems. The Tyan Transport CX TN73-B8037 has four front-serviced compute nodes, each one supporting one AMD EPYC 7003 Series processor. This 2U server platform can make short work of technical computing workloads that need to analyze and extract information from large data sets.With 768 MB of L3 cache, 3rd Gen AMD EPYC processors with 3D V-Cache technology can deliver up to a 66% performance improvement [2] across a variety of targeted technical computing workloads compared to standard 3rd Gen AMD EPYC processors. This enables faster time-to-results on targeted workloads and the ability to get products to market faster.
Built for the most demanding technical computing workloads, the Tyan Transport series is a line of world class barebones server systems based on AMD's latest technology, including 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology. For more information about our newest products, view the Tyan/AMD Product Catalog 2022.